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Telit Wireless Solutions(2)
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Maxim Integrated (美信)(1)
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Silicon Labs (芯科)(8)
ST Microelectronics (意法半导体)(3)
Microchip (微芯)(15)
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Inventek Systems(4)
ATMEL (爱特美尔)(3)
MMB Networks(1)
Antenova(1)
GainSpan(1)
Linx Technologies(9)
Digi International(7)
Linear Technology (凌力尔特)(6)
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Semtech Corporation(1)
LS Research(2)
muRata (村田)(1)
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Qualcomm (高通)(4)
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封装:
MODULE(28)
(10)
LQFP-24(1)
QFN-48(8)
LGA-48(1)
LQFP-64(2)
QFN-20(1)
QFN-32(4)
VFQFN-56(1)
QFN-60(1)
LQFP-32(1)
SMD(12)
VFQFN-32(2)
UFQFN-20(1)
SMD-16(1)
VFQFN-48(1)
48(1)
14.48x 13.46x 3.35mm(1)
SMD-40(1)
SMD-50(1)
SMD-24(1)
SMD-33(1)
SMD-27(2)
Surface Mount(7)
QFN-72(2)
SMD-32(1)
SMD-49(1)
LFCSP EP(2)
HVQFN-40(1)
-(1)
BGA-256(1)
QFN-68(1)
LQFP-48(1)
2.11 mm x 1.93 mm x 0.125 mm(1)
LFCSP-64(1)
DIE(12)
QFP-144(1)
SMD-52(1)
Screw(1)
3(1)
LGA-108(2)
BGA-169(1)
Adhesive(1)
Through Hole(4)
Panel(1)
9(1)
LFCSP(1)
压铸(2)
C-8(1)
780019(2)
C-12(1)
SIP-7(1)
SMA(1)
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包装:
Tray(138)
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